Exhibitor Press Releases

15 Dec 2024

Redefining thermal management with copper 3D printing

ToffeeX Stand: DC467
Redefining thermal management with copper 3D printing
Pin heat sink flow

ToffeeX, a physics-driven generative design company, in partnership with Imperial College London and the University of Wolverhampton, has achieved a groundbreaking milestone in heat sink design through the innovative use of multiscale modeling and high-purity copper 3D printing.

Backed by NATEP and Innovate UK, the ‘Multiscale Optimisation Framework for Aerospace Cold-Plates (MOfAC) Project’ is set to transform thermal management systems by demonstrating a new approach to design and simulation. The multiscale modeling framework is reshaping what’s possible in engineering – providing faster, better, and greener solutions for thermal management.

Thermal management

Computational fluid dynamics (CFD) has been a key tool in thermal management, but it faces significant challenges, including high computational demands – complex simulations require powerful hardware and long processing times; limited design iterations – slow processing restricts how many iterations can be explored; and accuracy trade-offs – engineers often compromise on resolution to save time, risking suboptimal designs.

The MOfAC project has introduced the multiscale modeling framework, which addresses these challenges by rethinking how thermal systems are simulated. Instead of modeling an entire system in one go, it breaks the problem into smaller, manageable units called ‘unit cells’.

Unlike traditional CFD, multiscale modeling reduces design time while maintaining exceptional accuracy. This efficiency allows engineers to iterate faster and explore broader design possibilities with unmatched speed and precision.

Additionally, leveraging high-purity copper – a material renowned for its thermal conductivity but historically difficult to 3D print – the University of Wolverhampton has employed advanced Laser Powder Bed Fusion (L-PBF) technology to produce the first-ever specimen using the new multiscale modeling framework.

ToffeeX, Imperial College London, and University of Wolverhampton advance thermal management with copper 3D printing and multiscale modeling.

Multiscale modeling

Benefits include computational efficiency – reducing the need for high-powered systems while accelerating design cycles; superior performance – heat sinks designed with this framework deliver exceptional thermal efficiency and durability and can be used in hydrogen fuel cells, advanced electronics, aerospace cooling systems, and more; and sustainability – aligning with global carbon reduction and sustainable engineering goals by optimizing energy use and delivering more effective cooling.

“ToffeeX is proud to lead this innovation in collaboration with Imperial College London and the University of Wolverhampton. This partnership exemplifies the power of interdisciplinary teamwork, where cutting-edge manufacturing and research expertise merge to address critical engineering challenges. Multiscale modeling and copper 3D printing capabilities are reshaping what’s possible in engineering, providing faster, better, and greener solutions for thermal management,” said Nicholas Raske, Senior Engineer at ToffeeX.

Innovation in copper AM

Copper’s exceptional thermal properties make it ideal for heat sinks, but its high reflectivity and tendency to oxidize have historically posed challenges for additive manufacturing. High reflectivity reduces energy absorption during laser-based processes, while oxidation can degrade material quality.

The University of Wolverhampton’s AMFM Research Group has tackled these issues using advanced laser technology and beam-shaping techniques. By improving energy absorption and ensuring precise process control, they’ve enabled the scalable production of high-performance copper components, setting a new benchmark in additive manufacturing.

“Working with ToffeeX, and Imperial College London pushing the boundaries of L-PBF copper printing and heat sink design highlights the potential of additive manufacturing and thermal management. By combining our expertise in advanced materials and 3D printing technologies, we will continue to develop innovative solutions that meet the growing demand for efficient thermal management systems across various industries,” said Professor Arun Arjunan, Director of the university’s Elite Centre for Manufacturing Skills (ECMS) and Centre for Engineering Innovation and Research (CEIR).

Generative design

The MOfAC project showcases the game-changing potential of physics-driven generative design. ToffeeX’s advanced algorithms and the multiscale framework allow engineers to achieve optimal designs faster, driving efficiencies across multiple industries.

Integrating multiscale modeling with copper 3D printing also marks a breakthrough. It delivers improved heat transfer performance while reducing energy demands. By innovating with pure copper designs, engineers can achieve superior thermal efficiency and significantly lower CO2 emissions, advancing the transition to a more sustainable future.

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